ASUS has introduced two cutting-edge motherboards at Computex 2024, targeting enthusiasts looking to harness the power of next-generation Intel and AMD processors. The ROG Maximus Hero BTF and X870 motherboards are poised to redefine user experience with their advanced features and design optimizations, slated for release in late 2024.
The ROG Maximus Hero BTF is designed specifically for the upcoming Intel Arrow Lake processors. This motherboard showcases a Back-to-Front (BTF) design that moves connectors to the rear, promoting a tidy internal appearance of PC builds.
This innovative layout supports the aesthetic needs of users preferring a minimalistic setup. The board also includes a high-power slot that is compatible with BTF graphics cards, like the ROG Strix GeForce RTX 4090 BTF, ensuring seamless integration with top-tier GPUs.
A notable innovation in the ROG Maximus Hero BTF is the PCIe Slot Q-Release Slim mechanism, which simplifies the graphics card removal process. This feature allows users to unlock the card by tilting it towards the latch, facilitating easier upgrades and maintenance without manually releasing the slot latch.
On the other hand, the ASUS X870 motherboard is tailored for the upcoming AMD Ryzen desktop processors. This motherboard is built to support robust CPU and memory overclocking capabilities, catering to hardcore gamers and tech enthusiasts. It also supports multi-GPU setups to meet the demands of increasingly graphics-intensive applications.
The X870 features extensive connectivity options. It supports PCIe 5.0 x16, providing ample bandwidth for high-performance GPUs and peripherals. It includes a 2.5 Gb Ethernet port for fast internet connections, multiple M.2 slots for speedy storage solutions, and USB4 ports to accommodate the latest high-speed devices.
Additionally, it offers high-bandwidth USB Type-C connectivity on the rear I/O panel and a front-panel Type-C header, ensuring flexibility for connecting a wide range of external devices.